We sold the last of the current batch of LD-1TX transmitter modules yesterday, and need to reorder the PCBs. Of course, this means the LD-1TR is also temporarily out of stock. I’m sorry if that inconveniences anyone, and will have TXs and TRs back in stock ASAP. In the meantime, we still have plenty of LD-1C receivers which are user-upgradeable to transceivers; an LD-1C with an LD-1TX installed is IDENTICAL to an LD-1TR.
We’re making a few revisions to the PCB layout to improve cooling and correct a one or two minor issues, so we will initially order four prototypes PCBs. Assuming the revisions don’t break anything, after assembling and (successfully) testing one board we will assemble the remaining three, and order a production batch of 50. If all goes well, that means four transmitter modules will be available within 3 weeks, and many more will be available within 4-5 weeks.
The main point of the revision is to reduce quiescent current to the relays (which will reduce heat) and to improve heat transfer between the PA and the aluminum enclosure. The enclosure acts as a heat sink, and does get warm when transmitting. Improving heat transfer will help to keep the PA devices cooler, and prevent automatic shutdown.
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